JPH0241454U - - Google Patents

Info

Publication number
JPH0241454U
JPH0241454U JP12056188U JP12056188U JPH0241454U JP H0241454 U JPH0241454 U JP H0241454U JP 12056188 U JP12056188 U JP 12056188U JP 12056188 U JP12056188 U JP 12056188U JP H0241454 U JPH0241454 U JP H0241454U
Authority
JP
Japan
Prior art keywords
semiconductor device
tips
leads
main body
outer shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12056188U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0737321Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988120561U priority Critical patent/JPH0737321Y2/ja
Publication of JPH0241454U publication Critical patent/JPH0241454U/ja
Application granted granted Critical
Publication of JPH0737321Y2 publication Critical patent/JPH0737321Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1988120561U 1988-09-14 1988-09-14 表面実装用半導体装置 Expired - Lifetime JPH0737321Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988120561U JPH0737321Y2 (ja) 1988-09-14 1988-09-14 表面実装用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988120561U JPH0737321Y2 (ja) 1988-09-14 1988-09-14 表面実装用半導体装置

Publications (2)

Publication Number Publication Date
JPH0241454U true JPH0241454U (en]) 1990-03-22
JPH0737321Y2 JPH0737321Y2 (ja) 1995-08-23

Family

ID=31366782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988120561U Expired - Lifetime JPH0737321Y2 (ja) 1988-09-14 1988-09-14 表面実装用半導体装置

Country Status (1)

Country Link
JP (1) JPH0737321Y2 (en])

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214546A (ja) * 1985-03-20 1986-09-24 Hitachi Tobu Semiconductor Ltd リ−ド切断成型装置
JPS62171148A (ja) * 1986-01-23 1987-07-28 Oki Electric Ind Co Ltd チツプキヤリア型icの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214546A (ja) * 1985-03-20 1986-09-24 Hitachi Tobu Semiconductor Ltd リ−ド切断成型装置
JPS62171148A (ja) * 1986-01-23 1987-07-28 Oki Electric Ind Co Ltd チツプキヤリア型icの製造方法

Also Published As

Publication number Publication date
JPH0737321Y2 (ja) 1995-08-23

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